iPhone 7: The Coming Apple's next handset could use USB Type C and wireless charging

  iPhone 7 could finally see Apple introduce wireless charging to its handsets

The iPhone 7 is coming in 2016, and it's going to be the best smartphone Apple has ever made. We can easily predict the iPhone 7 will be faster, thinner and prettier than the current handset, but it’s the other details we’re still waiting on. The most persistent rumours suggests that the iPhone 7 will be waterproof, but we’re hearing more rumours about Apple’s plans for the iPhone 7 everyday. While the iPhone 6s is a great handset, it’s got tough competition from the likes of Samsung, HTC, LG and Google’s Nexus smartphones - and in 2016 they won’t be standing still. That means Apple will need to seriously raise its game for the iPhone 7. So, what can we expect?
We can easily predict the iPhone 7 will be faster, thinner and prettier than the current handset, but it’s the other details we’re still waiting on. The most persistent rumours suggests that the iPhone 7 will be waterproof, but we’re hearing more rumours about Apple’s plans for the iPhone 7 everyday. Here’s everything we know about Apple’s next handset. 

iPhone 7: features

According to a now deleted post on the chinese social media service Weibo, Apple has produced five iPhone 7 prototypes - and is still in the process of working out which one to pick. The post suggests features of the iPhone 7 prototypes, and some of them seem more feasible than others. Wilder claims include the presence of a USB Type C input, and under-screen fingerprint scanner - but suggestions of wireless charging functionality and an improved multi-input 3D Touch seem far more likely. Other Android phones have used wireless charging for years, so it makes sense for Apple to finally introduce the feature.
As well introducing a raft of new rumours, the source also backs up several ones we've already seen. Interestingly, it confirms other reports that suggest Apple is testing AMOLED displays - but warns they won't be seen in an iPhone until 2018 or 2019.




Read: Here's what Microsoft has planned for Windows in 2016

iPhone 7: design

There are strong rumours that the next iPhone will be waterproof. After filing patent for ports that eject water, the company has filed a new one for connections that self-heal - and it solves one of the main challenges of making a phone waterproof.
Titled “Electronic Device With Hidden Connector,” the patent shows a connector covered by a self-healing elastomer. Diagrams included in the patent show the elastomer allowing the penetration of a probe, and self-sealing once the probe is removed. The port is shielded from the elements at all times, but still allows quick and easy access for charging, headphones or anything else.
Although the technology might not be featured on the iPhone 7, it shows the company is serious about introducing the feature in the future.
Other rumours suggest Apple will be removing the 3.5mm headphone jack for the iPhone 7. The report comes from the Japanese blog Macotakara, , and says that the iPhone 7 will instead force owners to use headphones that connect to the handset's Lightning port.
Although it may seem like a huge departure, the rumour isn’t as unlikely as it first sounds. Located at the bottom of the iPhone 6, the 3.5mm jack represents the largest opening on Apple’s handset. Removing it could not only allow Apple to reduce the size of the iPhone 7, but also increase its waterproof capability.
It also wouldn’t be the first time Apple dropped a industry standard from the iPhone. When Apple released the iPhone 5 back in 2012, it dropped its existing 30-pin dock connector for the Lightning interface.

iPhone 7 at a glance:

• Out in 2016
• Completely waterproof
• Could feature an much improved version of multi-touch

iPhone 7 specifications: processor
Apple traditionally currently uses both TSMC and Samsung to make the iPhone 6s' processors, but new reports suggest the company will be dropping Samsung for the iPhone 7’s A10 chip.
A new report by UBS suggests Apple is making the move because TSMC’s new InFO technology could allow Apple to create a smaller, thinner handset. “We believe TSMC could have close to a 100% market share in Apple’s new A processor (A10) foundry service in 2016 and use its Integrated Fan-Out (InFO) technology for packaging,” the report reads. “With the InFO technology, we expect Apple would benefit from better performance with smaller form factors.”
Although it seems unusual for Apple to drop a supplier as large as Samsung, there is validity to UBS’ claims. Apple wants to use System on Chip technology in later handsets, and will look to bundle LTE technology on the same chip as everything else. If that chip can be smaller and more efficient that the competition's, then Apple will be able to make the iPhone 7 smaller and thinner than its Android rivals. What’s more, Intel is also rumoured to be developing a cutting-edge 10-nanometer process for even faster and more efficient chips, which Apple will want in its next iPhones.

iPhone 7 specifications: memory

According to a report from TrendForce, the next iPhone will come with 3GB of RAM – the largest amount ever shipped in an iPhone. In comparison, the iPhone 6s had 2GB of Samsung LPDDR4 RAM, while the iPhone 6 used 1GB of slower, DDR3 RAM.

iPhone 7: release date

Although there isn’t a confirmed release date for the iPhone 7, we’re now very familiar with Apple’s release schedule. By looking at the release dates of previous iPhones, it’s possible to estimate when we’ll see the iPhone 7.
The iPhone 6s was released on 9 September this year, so it’s likely we’ll see the iPhone 7 released around the same time next year – probably alongside the announcement of the Apple Watch 2.

Credit: Alphr